Solder Analysis
Composition and impurity analysis of solder alloys, including tin-lead and lead-free.
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Solder Analysis
Solder performance depends on precise alloy composition and low impurity levels. Luvak analyzes solder alloys, including tin-lead and lead-free (such as SAC alloys), for major element composition and the trace impurities that affect wetting, joint strength, and reliability. Analysis is performed by ICP, DCP, and atomic absorption after in-house dissolution.
Solder analysis supports bath and pot monitoring, incoming material verification, and failure investigation.
Why Solder Analysis
Composition Control
Confirms the alloy is on spec.
Impurity Screening
Catches contaminants that hurt reliability.
Bath & Pot Monitoring
Tracks solder as it is used.
DETAILS
Test Offered
Alloy Composition
Tin, lead, silver, copper, and other elements.
Trace Impurity Screening
Contaminants that affect wetting and strength.
Solder Pot / Bath Monitoring
Composition over the bath lifecycle.
Materials And Products We Test
Solder Alloys
Bar, wire, and paste.
Solder Pots & Baths
In-service solder.
Tin-Lead & Lead-Free
Including SAC alloys.
Applicable Industries
Automotive
Energy
Electronics Manufacturing
Universities & R&D
ACCREDITATIONS
Luvak Laboratories is an ISO/IEC 17025 and NADCAP-accredited materials testing laboratory that has served the metals and materials industry for more than 50 years.
How it works
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Submit your sample
Dissolution into solution, handled in-house.
Analysis
ICP, DCP, and atomic absorption element detection.
Related services
ICP Elemental Analysis
Anion / Ion Chromatography
Metal Analysis